| Board-to-Board Configuration |
Right Angle |
| Centerline (Pitch) |
6.35 |
| Centerline (Pitch) |
2.54 |
| Centerline (Pitch) |
.25 |
| Centerline (Pitch) |
.1 |
| Circuit Application |
Power & Signal |
| Connector & Contact Terminates To |
Printed Circuit Board |
| Connector Mounting Type |
Board Mount |
| Connector System |
Board-to-Board |
| Contact Current Rating (Max) |
50 |
| Contact Mating Area Plating Material |
Noble Metal |
| Contact Mating Area Plating Thickness |
.76 |
| Contact Mating Area Plating Thickness |
30 |
| Contact Retention |
Without |
| Contact Termination Area Plating Material |
Tin |
| Contact Type |
Pin |
| Glow Wire Rating |
High Temperature Part - Not Glow Wire |
| Housing Color |
Black |
| Housing Material |
High Temperature Thermoplastic |
| Housing Type |
Plug |
| Mating & Unmating Configuration |
Sequencing |
| Mating Retention Type |
Boardlock |
| Number of Positions |
26 |
| Number of Power Positions |
10 |
| Number of Rows |
4 |
| Number of Signal Positions |
16 |
| Operating Temperature Range |
-40 – 257 |
| Operating Temperature Range |
-40 – 125 |
| Operating Voltage |
200 |
| Operating Voltage |
60 |
| Operating Voltage |
200 |
| Operating Voltage |
60 |
| PCB Mount Orientation |
Right Angle |
| PCB Mount Retention |
With |
| PCB Mount Retention Type |
Boardlock |
| Packaging Method |
Tray |
| Power Contact Material |
Tin |
| Product Type |
Header |
| Row-to-Row Spacing |
.1 |
| Row-to-Row Spacing |
2.54 |
| Sealable |
No |
| Termination Method to Printed Circuit Board |
Through Hole - Solder |
| Termination Post & Tail Length |
3.43 |
| Termination Post &Tail Length |
.135 |
| UL Flammability Rating |
UL 94V-0 |
| Underplate Material Thickness |
3.43 |
