Board-to-Board Configuration |
Right Angle |
Centerline (Pitch) |
2.54 |
Centerline (Pitch) |
.1 |
Centerline (Pitch) |
2.92 |
Centerline (Pitch) |
.115 |
Circuit Application |
Power & Signal |
Connector & Contact Terminates To |
Printed Circuit Board |
Connector Mounting Type |
Board Mount |
Connector System |
Board-to-Board |
Contact Current Rating (Max) |
50 |
Contact Mating Area Plating Material |
Noble Metal |
Contact Mating Area Plating Thickness |
3 |
Contact Mating Area Plating Thickness |
.076 |
Contact Retention |
Without |
Contact Termination Area Plating Material |
Tin |
Contact Type |
Pin |
Glow Wire Rating |
High Temperature Part - Not Glow Wire |
Housing Color |
Black |
Housing Material |
High Temperature Thermoplastic |
Housing Type |
Plug |
Mating & Unmating Configuration |
Sequencing |
Mating Retention Type |
Boardlock |
Number of Positions |
32 |
Number of Power Positions |
8 |
Number of Rows |
4 |
Number of Signal Positions |
24 |
Operating Temperature Range |
-40 – 257 |
Operating Temperature Range |
-40 – 125 |
Operating Voltage |
60 |
Operating Voltage |
60 |
PCB Mount Orientation |
Right Angle |
PCB Mount Retention |
With |
PCB Mount Retention Type |
Boardlock |
Power Contact Material |
Tin |
Product Type |
Header |
Row-to-Row Spacing |
2.54 |
Row-to-Row Spacing |
.1 |
Sealable |
No |
Termination Method to Printed Circuit Board |
Through Hole - Solder |
Termination Post & Tail Length |
3.43 |
Termination Post &Tail Length |
.135 |
UL Flammability Rating |
UL 94V-0 |
Underplate Material Thickness |
3.43 |