|
|
Lapp Group Ltd
13.1621
|
Multicomp
BMC8AG
|
Lapp Group Ltd
13.1622
|
Lapp Group Ltd
13.1624
|
Lapp Group Ltd
13.1630
|
Lapp Group Ltd
13.1633
|
Molex
200449-0001.
|
TE Connectivity
5-330495-3
|
TT electronics plc
ABCIRP16KLKP3
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TT electronics plc
ABCIRP16KPKP3
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| Price |
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| RoHS |
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| Lead Status |
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| Contact Angle |
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Straight |
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| Post Size |
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.79 x 1.57 |
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| PCB Mount Retention |
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Without |
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| Termination Type |
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Crimp to Post |
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| Contact Mating Area Plating Thickness |
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.762 |
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| Contact Mating Area Plating Material |
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Tin |
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| Connector & Contact Terminates To |
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Wire & Cable |
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| Contact Termination Area Plating Thickness |
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30 |
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| Wire Insulation Support |
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Without |
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| Color Code |
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Red |
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| Packaging Method |
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Clip/Reel |
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| Wire/Cable Size |
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.2 |
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| Contact Base Material |
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Phosphor Bronze |
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| Contact Termination Area Plating Material |
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Tin |
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| Product Type |
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Termination Point Clip |
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| Packaging Quantity |
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1000 |
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