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Japan Aviation Electronics Industry, Limited (JAE) FO-EX-SCAD1-001 |
Japan Aviation Electronics Industry, Limited (JAE) FO-FC-DC2 |
Japan Aviation Electronics Industry, Limited (JAE) FO-FC-FS(DIA)-STD-PBS-R |
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| RoHS | Compliant | Not Compliant | Compliant | Compliant | Compliant | Not Compliant | Compliant | ||||
| Lead Status | No | No | No | No | Yes | No | |||||
| EMI Containment Feature Type | External Springs | ||||||||||
| Cage Material | Nickel Silver | ||||||||||
| Connector Mounting Type | Board Mount | ||||||||||
| Connector & Contact Terminates To | Printed Circuit Board | ||||||||||
| Connector System | Cable-to-Board | ||||||||||
| Heat Sink Compatible | Yes | ||||||||||
| Form Factor | SFP+ | ||||||||||
| Cage Type | Single | ||||||||||
| PCB Thickness (Recommended) | 2.25 | ||||||||||
| Included Lightpipe | No | ||||||||||
| Included Heat Sink | No | ||||||||||
| Pluggable I/O Applications | SFP+ | ||||||||||
| Product Type | Cage | Connector | |||||||||
| Number of Ports | 1 | ||||||||||
| Tail Length | 2.05 | ||||||||||
| For Use With Pluggable I/O Products | SFP+ SMT Connector | ||||||||||
| Port Matrix Configuration | 1 x 1 | ||||||||||
| Data Rate (Max) | 16 | ||||||||||
| PCB Mounting Style | Through Hole Press-Fit | ||||||||||
| Operating Temperature Range | -67 – 221 | ||||||||||
| Packaging Method | Tray | Blister | |||||||||
| Sealable | No | ||||||||||
| Termination Method to Printed Circuit Board | Through Hole - Press-Fit | ||||||||||
| Connector Style | Receptacle | Duplex | |||||||||
| Housing Color | Black | Beige | |||||||||
| Mode | Singlemode | Multimode | |||||||||
| Outside Cable Diameter | .188 – .31 | ||||||||||
| System | LIGHTCRIMP | ||||||||||
| Boot Color | Beige | ||||||||||
| Connector Color | Beige | ||||||||||
| Fiber Type | OM2 | ||||||||||
| Fiber Diameter | 125 | ||||||||||
| Pre-Polished | No | ||||||||||
| Epoxyless | No | ||||||||||
| Endface Geometry | PC | ||||||||||
| Packaging Quantity | 1 |
