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TE Connectivity
2312741-1
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TE Connectivity
2170563-1
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TE Connectivity
5-1761199-1
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TE Connectivity
5-1761182-6
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TE Connectivity
2198373-3
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TE Connectivity
2-2198346-0
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TE Connectivity
2149731-1
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TE Connectivity
5175475-5
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TE Connectivity
1734101-8
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TE Connectivity
787653-3
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| Price |
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| RoHS |
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Compliant |
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| Lead Status |
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No |
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| Number of Positions |
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29 |
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76 |
320 |
84 |
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| Connector System |
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Wire-to-Board |
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Cable-to-Board |
Cable-to-Board |
Cable-to-Board |
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| Number of Ports |
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1 |
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2 |
16 |
1 |
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| Centerline (Pitch) |
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.8 |
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.8 |
.8 |
.031 |
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| Connector Mounting Type |
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Board Mount |
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Board Mount |
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Board Mount |
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| Connector & Contact Terminates To |
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Printed Circuit Board |
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Printed Circuit Board |
Printed Circuit Board |
Printed Circuit Board |
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| Operating Temperature Range |
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0 – 55 |
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-40 – 85 |
-67 – 221 |
-40 – 85 |
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| PCB Mount Orientation |
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Vertical |
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| Contact Current Rating (Max) |
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1.5 |
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.5 |
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.5 |
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| PCB Mounting Style |
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Surface Mount |
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Through Hole Press-Fit |
Double-Sided (Belly-to-Belly) |
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| Circuit Application |
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Power & Signal |
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Signal |
Signal |
Signal |
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| Connector Style |
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Receptacle |
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Receptacle |
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| Number of Rows |
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1 |
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| Sealable |
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No |
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Yes |
No |
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| PCB Thickness (Recommended) |
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1.57 |
.059 |
.062 |
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| Form Factor |
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zQSFP+ |
zSFP+ |
CXP |
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| Lightpipe Configuration |
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Outer Left Indicator Down |
Reversed Outer |
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| Contact Underplating Material |
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Tin |
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| Data Rate (Max) |
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28 |
32 |
125 |
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| Cage Material |
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Nickel Silver |
Nickel Silver Alloy |
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| EMI Containment Feature Type |
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Elastomeric Gasket |
External Springs |
Internal/External Springs |
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| PCB Contact Termination Area Plating Material |
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Gold |
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| Tail Length |
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2 |
1.8 |
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| Enhancements |
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Standard |
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| Included Lightpipe |
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Yes |
Yes |
No |
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| Contact Mating Area Plating Thickness |
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30 |
29.92 |
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| Heat Sink Compatible |
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No |
No |
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| Cage Type |
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Stacked |
Stacked |
Single |
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| Included Heat Sink |
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No |
No |
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| Contact Mating Area Plating Material |
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Gold |
Gold or Gold Flash over Palladium Nickel |
Gold or Gold Flash over Palladium Nickel |
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| Pluggable I/O Applications |
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Standard |
zSFP+ Thermally Enhanced |
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| Packaging Method |
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Box & Tray |
Tray |
Box & Tray |
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| Port Matrix Configuration |
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2 x 1 |
2 x 8 |
1 x 1 |
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| For Use With Pluggable I/O Products |
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QSFP Cable Assembly |
zSFP+ SMT Connector |
CXP Cable Assembly |
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| Product Type |
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Cage Assembly with Integrated Connector |
Cage Assembly with Integrated Connector |
Receptacle Assembly |
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| Rear EONs per Port Column |
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3 |
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| UL Flammability Rating |
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UL 94V-0 |
UL 94V-0 |
UL 94V-0 |
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| Termination Method to Printed Circuit Board |
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Through Hole - Press-Fit |
Through Hole - Press-Fit |
Through Hole - Press-Fit |
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| Lightpipe Style |
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Standard |
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| Tail Plating Material |
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Tin |
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| Integrated Lightpipes |
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Yes |
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| Plating Material |
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Tin over Nickel |
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| Housing Material |
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LCP (Liquid Crystal Polymer) |
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| Cage Plating Material |
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Tin over Nickel |
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| Contact Base Material |
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Copper Alloy |
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| Profile Height |
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.455 |
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| Bezel Mounting Style |
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Through Bezel |
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