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Molex
55836-2070
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TE Connectivity
5787851-1
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TE Connectivity
5787855-2
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TE Connectivity
552305-1
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TE Connectivity
5557932-1
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TE Connectivity
553599-1
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TE Connectivity
554084-1
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HARTING Limited
60050685100
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Molex
74754-0044
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Amphenol
10112633-121LF
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| Price |
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| RoHS |
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Compliant |
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Not Compliant |
Not Compliant |
Not Compliant |
| Lead Status |
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Yes |
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Yes |
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| Guide Socket/Pin Plating Material |
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Nickel over Copper |
Nickel over Copper |
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| Retention Leg Plating Material |
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Tin over Nickel |
Tin over Nickel |
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| PCB Mount Orientation |
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Right Angle |
Right Angle |
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| Termination Post Length |
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.01 |
3.18 |
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| Shell Plating Material |
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Nickel over Copper |
Nickel over Copper |
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| Centerline (Pitch) |
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.05 |
.05 |
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| Connector Mounting Type |
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Board Mount |
Board Mount |
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| Connector & Contact Terminates To |
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Printed Circuit Board |
Printed Circuit Board |
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| Connector System |
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Cable-to-Board |
Cable-to-Board |
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| Number of Positions |
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200 |
200 |
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| Number of Rows |
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8 |
8 |
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| Contact Base Material |
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Copper Alloy |
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| Contact Type |
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Socket |
Plug |
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| Contact Mating Area Plating Thickness |
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30 |
30 |
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| PCB Mount Alignment |
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Without |
Without |
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| Connector Style |
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Receptacle |
Plug |
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| Guide Socket/Pin Material |
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Brass |
Brass |
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| Shell Material |
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Carbon Steel |
Carbon Steel |
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| Retention Leg Material |
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Brass |
Brass |
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| PCB Contact Termination Area Plating Material |
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Tin |
Tin |
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| Housing Material |
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Polyester |
Polyester |
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| UL Flammability Rating |
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UL 94V-0 |
UL 94V-0 |
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| Product Type |
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Connector |
Connector |
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| Connector Type |
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Connector Assembly |
Connector Assembly |
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| Ground Plate Material |
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Stainless Steel |
Stainless Steel |
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| Contact Current Rating (Max) |
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.5 |
.5 |
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| Contact Mating Area Plating Material |
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Gold |
Gold |
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| Locking Screw |
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Without |
Without |
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| Circuit Application |
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Signal |
Signal |
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| Operating Temperature Range |
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-67 – 185 |
-67 – 185 |
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| Housing Temperature Rating |
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Standard |
Standard |
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| Number of Utility Contacts |
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0 |
0 |
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| Housing Color |
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Natural |
Natural |
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| PCB Mounting Style |
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Through Hole |
Through Hole |
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| Number of Power Positions |
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0 |
0 |
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| Contact Underplating Material |
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Nickel |
Nickel |
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| PCB Mount Retention Type |
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Boardlock |
Boardlock |
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| Packaging Method |
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Tray |
Tray |
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| Profile |
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Low |
Low |
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| Center Ground Plate |
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With |
With |
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| Number of Signal Positions |
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200 |
200 |
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| Packaging Quantity |
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24 |
24 |
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| Sealable |
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No |
No |
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| PCB Mount Retention |
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With |
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