|
|
TE Connectivity
554953-2
|
TE Connectivity
554950-2
|
TE Connectivity
554954-2
|
TE Connectivity
1735284-4
|
TE Connectivity
1-1761987-8
|
TE Connectivity
2227580-1
|
TE Connectivity
2023246-2
|
TE Connectivity
553603-1
|
TE Connectivity
2-552001-1
|
TE Connectivity
5749069-5
|
| Price |
|
|
|
|
|
|
|
|
|
|
|
| RoHS |
|
|
|
|
|
|
|
|
|
|
|
| Lead Status |
|
|
|
|
|
|
|
|
|
|
|
| Number of Positions |
|
|
|
|
22 |
38 |
36 |
22 |
|
|
|
| Contact Configuration |
|
|
|
|
7P + 15P |
|
|
7P + 15P |
|
|
|
| UL Flammability Rating |
|
|
|
|
UL 94V-0 |
UL 94V-0 |
UL 94V-0 |
UL 94V-0 |
|
|
|
| Mounting Location |
|
|
|
|
Top |
|
|
Top |
|
|
|
| Number of Rows |
|
|
|
|
1 |
|
4 |
1 |
|
|
|
| Centerline (Pitch) |
|
|
|
|
.05 |
.8 |
.029 |
.05 |
|
|
|
| Connector Mounting Type |
|
|
|
|
Board Mount |
Board Mount |
|
Board Mount |
|
|
|
| Boardlock Length |
|
|
|
|
.8 |
|
|
.075 |
|
|
|
| Connector & Contact Terminates To |
|
|
|
|
Printed Circuit Board |
Printed Circuit Board |
Printed Circuit Board |
Printed Circuit Board |
|
|
|
| Connector System |
|
|
|
|
Cable-to-Board |
Board-to-Board |
Cable-to-Board |
Cable-to-Board |
|
|
|
| Contact Base Material |
|
|
|
|
Copper Alloy |
|
Copper Alloy |
Copper Alloy |
|
|
|
| Contact Mating Area Plating Thickness |
|
|
|
|
15 |
15 |
|
.3 |
|
|
|
| PCB Termination Area Plating Finish |
|
|
|
|
Matte |
|
|
Matte |
|
|
|
| PCB Thickness (Recommended) |
|
|
|
|
1.2 |
.057 |
.062 |
1.2 |
|
|
|
| Packaging Method |
|
|
|
|
Tray |
Tape |
Box & Tray |
Tray |
|
|
|
| Operating Temperature Range |
|
|
|
|
-40 – 85 |
-67 – 221 |
-67 – 185 |
-40 – 85 |
|
|
|
| PCB Contact Termination Area Plating Material |
|
|
|
|
Tin |
Tin |
Tin |
Tin |
|
|
|
| Comment |
|
|
|
|
Low Profile Backplane |
|
|
|
|
|
|
| PCB Mount Orientation |
|
|
|
|
Vertical |
|
Right Angle |
Right Angle |
|
|
|
| Number of Ports |
|
|
|
|
2 |
|
1 |
2 |
|
|
|
| Height above PC Board |
|
|
|
|
6.6 |
|
13.9 |
.205 |
|
|
|
| Housing Material |
|
|
|
|
High Temperature Thermoplastic |
|
LCP (Liquid Crystal Polymer) |
Thermoplastic |
|
|
|
| PCB Mount Retention |
|
|
|
|
With |
|
With |
With |
|
|
|
| Mating Alignment Type |
|
|
|
|
Polarization |
|
|
Polarization |
|
|
|
| PCB Mounting Style |
|
|
|
|
Surface Mount |
|
Through Hole Press-Fit |
Surface Mount |
|
|
|
| Connector Style |
|
|
|
|
Receptacle |
|
Receptacle |
Receptacle |
|
|
|
| High Temperature Housing |
|
|
|
|
Yes |
|
Yes |
Yes |
|
|
|
| Circuit Application |
|
|
|
|
Power & Signal |
Signal |
Signal |
Power & Signal |
|
|
|
| Packaging Quantity |
|
|
|
|
48 |
|
|
30 |
|
|
|
| Profile |
|
|
|
|
Standard |
|
|
Standard |
|
|
|
| Contact Current Rating (Max) |
|
|
|
|
1.5 |
.5 |
|
1.5 |
|
|
|
| Housing Color |
|
|
|
|
Black |
|
Black |
Black |
|
|
|
| PCB Mount Retention Type |
|
|
|
|
Solder Peg |
|
M2 Screw |
Solder Peg |
|
|
|
| Product Type |
|
|
|
|
Connector |
Connector |
Connector |
Connector |
|
|
|
| Shell |
|
|
|
|
Without |
|
Without |
Without |
|
|
|
| Keyed |
|
|
|
|
Yes |
|
|
Yes |
|
|
|
| Stackable |
|
|
|
|
No |
|
No |
No |
|
|
|
| Contact Mating Area Plating Material |
|
|
|
|
Gold |
Gold |
Conforms to the requirements of TE product specification 108-32038 based on EIA/ECA-364-1000.0IA. |
Gold |
|
|
|
| Product Grouping |
|
|
|
|
SATA |
|
Internal Mini-SAS HD |
SATA |
|
|
|
| Termination Method to Printed Circuit Board |
|
|
|
|
|
Surface Mount |
|
|
|
|
|
| For Use With Pluggable I/O Products |
|
|
|
|
|
QSFP+ Cage |
|
|
|
|
|
| Included Heat Sink |
|
|
|
|
|
No |
|
|
|
|
|
| Form Factor |
|
|
|
|
|
QSFP+ |
|
|
|
|
|
| Sealable |
|
|
|
|
|
No |
|
|
|
|
|
| Receptacle Configuration |
|
|
|
|
|
|
Mini-SAS HD |
|
|
|
|
| Termination Post Length |
|
|
|
|
|
|
|
.05 |
|
|
|
| Boardlock Plating Material |
|
|
|
|
|
|
|
Tin |
|
|
|
