Telecom Interface ICs Quad E1-T1-J1 Transceiver

Digital Isolators Quad-CH Digital EH System-Level ESD

BOARD EXTENDER AUDIO EI3; Silicon Manufacturer:Analog Devices; Core Architecture:DSP; Core Sub-Architecture:-; Silicon Core Number:ADAU1761; Silicon Family Name:Blackfin; For Use With:ADSP-BF60x Processor Boards; Product Range:- ;RoHS Compliant: Yes

General Purpose Digital Isolator 2500Vrms 4 Channel 10Mbps 25kV/µs CMTI 16-SOIC (0.295", 7.50mm Width)

Video ICs Selectable HD/HD Video Filter and Buffer

Four ADC, Two DAC, Low Power Codec with Audio DSPs Features: Programmable FastDSP audio processing engine Up to 768 kHz sample rate Biquad filters, limiters, volume controls, mixing 28-bit SigmaDSP audio processing core Visually programmable using SigmaStudio Up to 50 MIPS performance Low latency, 24-bit ADCs and DACs 96 dB SNR (signal through PGA and ADC with A-weighted filter) 105 dB combined SNR (signal through DAC and headphone with A-weighted filter) Serial port fSYNC frequency from 8 kHz to 768 kHz 5 μs group delay (fS = 768 kHz) analog in to analog out with FastDSP bypass (zero instructions) 4 single-ended analog inputs, configurable as microphone or line inputs 8 digital microphone inputs 2 analog differential audio outputs, configurable as either line output or headphone driver PLL supporting any input clock rate from 30 kHz to 27 MHz Full-duplex, 4-channel ASRCs 2, 16-channel serial audio ports supporting I2S, left justified, or up to TDM16 8 interpolators and 8 decimators with flexible routing Power supplies Analog AVDD at 1.8 V typical Digital I/O IOVDD at 1.1 V to 1.98 V Digital DVDD at 0.9 V typical Low power (11.079 mW for typical stereo ANC settings) I2C and SPI control interfaces, self boot from I2C EEPROM Flexible GPIO 42-ball, 0.35 mm pitch, 2.695 mm × 2.320 mm WLCSP

GaAs MMIC I/Q Upconverter, 37 - 40 GHz Features: Conversion Gain: 10 dB Sideband Rejection: 17 dBc High Output IP3: +27 dBm 16 Lead 5x5 mm SMT Ceramic Package: 25 mm2

9 GHz to 12 GHz, GaAs, MMIC, I/Q Downconverter Features: Conversion gain: 11 dB (typical) at IFOUT = 100 MHz Image rejection: 25 dB (typical) at IFOUT = 100 MHz LO to RF isolation: 46 dB (typical) LO to IF isolation: 26 dB (typical) IF output frequency: dc to 3.5 GHz 32-lead, 4.9 mm × 4.9 mm ceramic leadless chip carrier

3GHz HDMI 2:2 cross point Transceiver with On-Screen Display Features: 2-input, 2-output cross-point HDMI® transceiver HDMI support 3 GHz video support (e.g. 4k × 2k) Audio return channel (ARC) 3D TV support Content type bits CEC 1.4-compatible Extended colorimetry High-Bandwidth Digital Content Protection (HDCP 1.4) Ultralow jitter digital PLL (100% deskew) Character- and icon-based on-screen display (OSD) 3D OSD overlay on all mandatory 3D formats Support for OSD overlay on 3 GHz video formats HDCP repeater support: up to 127 KSVs supported 300 MHz maximum TMDS clock frequency (up to 4k × 2k) 48-, 36-, 30-bit deep colour input modes supported See data sheet for additional features

Clock-Tunable, Quad Second Order, Filter Building Blocks Features: Four Identical 2nd Order Filter Sections in an SSOP Package 2nd Order Section Center Frequency Error: ±0.3% Typical and ±0.8% Maximum Low Noise per 2nd Order Section, Q ≤ 5: LTC1068-200 50µVRMS, LTC1068 50µVRMS  LTC1068-50 70µVRMS, LTC1068-25 90µVRMS Low Power Supply Current: 4.5mA, Single 5V, LTC1068-50 Operation with ±5V Power Supply, Single 5V Supply or Single 3.3V Supply