The Blackfin® Processor family has been expanded to address the ever-increasing need for pervasive embedded network connectivity. This connectivity is powerful when utilized in conjunction with the high performance 16-/32-bit Blackfin embedded processor core, the flexible cache architecture, the enhanced DMA subsystem, and the Dynamic Power Management (DPM) functionality. System designers can take advantage of the combined control and signal processing capabilities of the processor core across a wide range of end applications through the scalability of the pin and code compatibility of these new family members. The ADSP-BF536 and ADSP-BF537 are a functional extension of the popular ADSP-BF531 / ADSP-BF532 / ADSP-BF533 processors, and they are ideally suited for a variety of networked applications. The ADSP-BF537 is the higher performance series member, with more embedded memory enabling higher throughput needs for embedded applications suchas video security/surveillance and industrial-environment-based distributed control/factory automation applications. The ADSP-BF536 offers exceptional performance and is designed for low cost connected devices such as remote monitoring devices, VoIP, point-of-sale terminals, and biometrics/security applications. Both devices are ideally suited for a broadrange of industrial, instrumentation, medical, and consumer appliance applications— allowing for scalability based upon the required network bandwidth and mix of control, plus signal processing needed in the end product.

The Blackfin processor family is extended further into the industrial and instrumentation market with the availability of an on chip eMAC, a 3-phase PWM generation unit and a quadrature encoder. The high performance 16/32-bit Blackfin embedded processor core, the flexible cache architecture, the enhanced DMA subsystem, and the dynamic power management (DPM) functionality allow system designers a flexible platform to address a wide range of connected applications, including motor control, power line monitoring, biometrics, pro-audio and femto cells. The embedded eMAC of the BF516 coupled with a 400MHz CPU and a plethora of other peripherals make the BF516 the most attractive choice for demanding network connected systems.The VoIP challenge to the embedded-system designer is to choose a processing solution that is cost-effective, easy to deploy and scaleable in performance across market spaces. A “sweet spot” embedded-solution approach is to design with a platform that can implement a low channel count basic VoIP solution, yet retain sufficient capacity for value added capabilities and services – such as video, music, imaging and system control. Unlike traditional VoIP embedded solutions that utilize two processor cores to provide VoIP functionality, the ADSP-BF516 provides a convergent solution in a unified core architecture that allows voice and video signal processing concurrent with RISC MCU processing to handle network and user-interface demands. This unique ability to offer full VoIP functionality on a single convergent processor provides for a unified software development environment, faster system debugging and deployment, and lower overall system cost.The BF516 also brings ultra low power and a removable storage interface covering SDIO, CE-ATA and eMMC for portable devices.IP protection has become a necessary part of today’s embedded computing applications. The ADSP-BF516 provides a security scheme which balances flexibility and upgradeability with performance through the inclusion of a firmware-based solution including OTP (One Time Programmable) memory to enable users to implement private keys for secure access to program code.

Configurable Impedance Network Analyzer & Potentiostat with Integrated Cortex M3 Core Features: Analog performance 160 kSPS, 16-bit, precision analog-to-digital converter (ADC) 4 dedicated voltage measurement channels 8 current measurement channels Impedance measurement engine High precision voltage reference Supply noise rejection filtering Ultralow leakage configurable switch matrix 12-bit digital-to-analog converter (DAC) Precision instrumentation amplifier control loop 6-channel CapTouch controller Temperature sensor Analog hardware accelerators Autonomous analog front-end (AFE) controller Independent sequencer for AFE functions Direct digital synthesizer (DDS)/arbitrary waveform generator Receive filters Complex impedance measurement (DFT) engine Processing 16 MHz ARM Cortex-M3 processor 384 kB of embedded flash memory 32 kB system SRAM 16 kB Flash configured EEPROM Integrated full-speed USB 2.0 controller and PHY Multilayer advanced microcontroller bus architecture (AMBA) bus matrix Central direct memory access (DMA) controller Real-time clock (RTC) General-purpose, wake-up, and watchdog timers Communication Input/output I2S and beeper interface LCD display controller (parallel and serial) LCD segment controller SPI, I2C, and UART peripheral interfaces Programmable GPIOs Power Coin cell battery compatible 2.5 V to 3.6 V active measurement range Power management unit (PMU) Power-on reset (POR) and power supply monitor (PSM) Packages and temperature range Operating temperature range: −40°C to +85°C Package: 120-lead, 8 mm × 8 mm CSP_BGA 

RapID Platform Generation 2 (RPG2) Network Interface Features: Configurable industrial protocol support PROFINET RT (Class B) PROFINET IRT (Class C): coming soon EtherNet/IP with DLR EtherCAT All protocols precertified Configurable applications processor interface UART: 115,200 bps to 1,000,000 bps Ethernet at 10 Mbps or 100 Mbps SPI follower: 10 MHz maximum clock I2C, QSPI, and CAN: future option Industrial Ethernet interface-compliant to IEEE 802.3, 10Base or 100Base transmit half and full duplex Single 3.3 V power supply, 840 mW Cycle time down to 1 ms (cycle times vary based on protocol, link type, and application data) 194-ball chip-scale package BGA form factor RoHS 3 compliant –40°C to +85°C industrial temperature range

RapID Platform Generation 2 (RPG2) Network Interface Features: Configurable industrial protocol support PROFINET RT (Class B) PROFINET IRT (Class C): coming soon EtherNet/IP with DLR EtherCAT All protocols precertified Configurable applications processor interface UART: 115,200 bps to 1,000,000 bps Ethernet at 10 Mbps or 100 Mbps SPI follower: 10 MHz maximum clock I2C, QSPI, and CAN: future option Industrial Ethernet interface-compliant to IEEE 802.3, 10Base or 100Base transmit half and full duplex Single 3.3 V power supply, 840 mW Cycle time down to 1 ms (cycle times vary based on protocol, link type, and application data) 194-ball chip-scale package BGA form factor RoHS 3 compliant –40°C to +85°C industrial temperature range

Networking Development Tools REPLACED by DC2274A-A - SmartMesh IP RF Certified Eval/Dev Manager (MMCX antenna connector), 100 mote capacity

CLOCK & TIMING ANALOG DEV KITS;

Low Power 200MHz Blackfin+ Embedded Processor with 128KByte L2 SRAM Features: Blackfin+ core with up to 200 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin product On-Chip Memory 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad) 128KByte on-chip L2 SRAM with ECC protection 512KByte On-chip L2 ROM Key Peripherals include USB2.0 HS OTG 2x CAN2.0B ePPI Video I/O 2x SPORTs (w/I2S) 2xQuad-SPI / 1xDual-SPI (w/ Host mode option) I2C 2xUART SD/SDIO/MMC (4-bit) Security and one-time-programmable memory Crypto hardware accelerators for fast secure boot/IP protection memDMA encryption/decryption for fast run-time security Low-cost packaging 88-Lead LFCSP (QFN) package (12 mm × 12mm), RoHS compliant Low system power with < 53 mW at 200 MHz at 25°C TJUNCTION

Low Power 200MHz Blackfin+ Embedded Processor with 128KByte L2 SRAM & DDR2/LPDDR Interface Features: Blackfin+ core with up to 200 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin product On-Chip Memory 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad) 128KByte on-chip L2 SRAM with ECC protection 512KByte On-chip L2 ROM L3 interface providing 16-bit interface to DDR2 or LPDDR SDRAM devices (up to 200 MHz) Key Peripherals include USB2.0 HS OTG 2x CAN2.0B ePPI Video I/O 2x SPORTs (w/I2S) 2xQuad-SPI / 1xDual-SPI (w/ Host mode option) I2C 2xUART SD/SDIO/MMC (8-bit) 4-ch 12-bit 1MSPS ADC Security and one-time-programmable memory Crypto hardware accelerators for fast secure boot/IP protection memDMA encryption/decryption for fast run-time security Low-cost packaging 184-Ball CSP_BGA package (12 mm × 12mm × 0.8mm pitch), RoHS compliant Low system power with < 53 mW at 200 MHz at 25°C TJUNCTION

Low Power 400MHz Blackfin+ Embedded Processor with 256KByte L2 SRAM & DDR2/LPDDR Interface Features: Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin product On-Chip Memory 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad) 256KByte on-chip L2 SRAM with ECC protection 512KByte On-chip L2 ROM L3 interface providing 16-bit interface to DDR2 or LPDDR SDRAM devices (up to 200 MHz) Key Peripherals include USB2.0 HS OTG 2x CAN2.0B ePPI Video I/O 2x SPORTs (w/I2S) 2xQuad-SPI / 1xDual-SPI (w/ Host mode option) I2C 2xUART SD/SDIO/MMC (8-bit) 4-ch 12-bit 1MSPS ADC Security and one-time-programmable memory Crypto hardware accelerators for fast secure boot/IP protection memDMA encryption/decryption for fast run-time security Low-cost packaging 184-Ball CSP_BGA package (12 mm × 12mm × 0.8mm pitch), RoHS compliant Low system power with < 100 mW at 400 MHz (< 0.25 mW/MHz) at 25°C TJUNCTION