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TE Connectivity
917512-5
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TE Connectivity
84696-1
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TE Connectivity
1318986-6
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TE Connectivity
917804-3
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TE Connectivity
179956-6
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TE Connectivity
1-917511-3
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TE Connectivity
1318105-1
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TE Connectivity
2-6450540-0
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TE Connectivity
6450130-3
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TE Connectivity
1888803-1
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Price |
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RoHS |
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Lead Status |
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Operating Voltage |
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60 |
60 |
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Number of Rows |
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4 |
4 |
2 |
Housing Color |
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Black |
Black |
Gray |
Connector Mounting Type |
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Board Mount |
Board Mount |
Board Mount |
Mating Retention Type |
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Action/Compliant Tail |
Boardlock |
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Connector & Contact Terminates To |
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Printed Circuit Board |
Printed Circuit Board |
Printed Circuit Board |
Number of Positions |
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30 |
32 |
34 |
Number of Signal Positions |
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24 |
24 |
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Board-to-Board Configuration |
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Vertical |
Right Angle |
Right Angle |
Contact Current Rating (Max) |
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42 |
42 |
30 |
Contact Retention |
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Without |
Without |
With |
Contact Mating Area Plating Thickness |
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.076 |
.076 |
30 |
UL Flammability Rating |
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UL 94V-0 |
UL 94V-0 |
UL 94V-0 |
Termination Post & Tail Length |
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3.43 |
4.19 |
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Glow Wire Rating |
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High Temperature Part - Not Glow Wire |
High Temperature Part - Not Glow Wire |
Standard Part - Not Glow Wire |
Packaging Method |
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Tray |
Box |
Tube |
Contact Type |
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Socket |
Pin |
Pin |
Housing Type |
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Receptacle |
Plug |
Plug |
PCB Mount Orientation |
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Vertical |
Right Angle |
Right Angle |
Row-to-Row Spacing |
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.1 |
.1 |
.354 |
Underplate Material Thickness |
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3.43 |
4.19 |
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Centerline (Pitch) |
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6.35 |
7.62 |
.177 |
PCB Mount Retention |
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With |
With |
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Connector System |
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Board-to-Board |
Board-to-Board |
Board-to-Board |
Product Type |
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Connector Assembly |
Header |
Connector Assembly |
Termination Post &Tail Length |
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.135 |
.165 |
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Contact Mating Area Plating Material |
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Noble Metal |
Noble Metal |
Gold |
Circuit Application |
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Power & Signal |
Power & Signal |
Power & Signal |
Number of Power Positions |
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6 |
8 |
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Contact Termination Area Plating Material |
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Tin |
Tin |
Tin over Nickel |
Housing Material |
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High Temperature Thermoplastic |
High Temperature Thermoplastic |
Thermoplastic |
PCB Mount Retention Type |
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Boardlock |
Boardlock |
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Power Contact Material |
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Tin |
Tin |
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Sealable |
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No |
No |
No |
Termination Method to Printed Circuit Board |
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Through Hole - Press-Fit |
Through Hole - Solder |
Through Hole - Press-Fit |
Operating Temperature Range |
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-20 – 105 |
-20 – 105 |
-55 – 125 |
Mating & Unmating Configuration |
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Sequencing |
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Contact Base Material |
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Copper Alloy |
Number of Active Positions |
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26 |
Selectively Loaded |
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See Print for Loaded Positions |