MPGCSP30NS-200-3.0A

Multicomp
NON-SILICONE THERMAL PAD, 200X3MM, GRY

2191835

Henkel
THERMAL GAP PAD, SLICONE FREE POLYMER; Thermal Conductivity:3W/m.K; Conductive Material:Silicone Free Polymer; Thickness:0.125"; Thermal Impedance:-; Dielectric Strength:-; External Length:-; External Width:-
Distributor SKU Stock MOQ 1 10 50 100 1,000 10,000
Newark 2191835 0 1 $341.63 $341.63 $341.63 $341.63 $341.63 $341.63

2591009

Henkel
THERMAL GAP FILLER PAD, SILICONE, GREY; Thermal Conductivity:10W/m.K; Conductive Material:Silicone; Thickness:-; Thermal Impedance:-; Dielectric Strength:-; External Length:8"; External Width:8"
Distributor SKU Stock MOQ 1 10 50 100 1,000 10,000
Newark 2591009 0 1 $0.00 $0.00 $0.00 $0.00 $0.00 $0.00

2678611

Henkel
THERMAL GAP FILLER PAD, SILICONE, GREY; Thermal Conductivity:12W/m.K; Conductive Material:Silicone; Thickness:-; Thermal Impedance:-; Dielectric Strength:-; External Length:8"; External Width:8"
Distributor SKU Stock MOQ 1 10 50 100 1,000 10,000
Newark 2678611 0 1 $0.00 $0.00 $0.00 $0.00 $0.00 $0.00

40006005

Wurth Elektronik
THERMALLY COND MATERIAL, SILICONE, 0.5MM;

40003020

Wurth Elektronik
THERMALLY COND MATERIAL, SILICONE, 2MM;

40005020

Wurth Elektronik
THERMALLY COND MATERIAL, SILICONE, 2MM;

402116302020

Wurth Elektronik
HEAT SINK PAD, 300MM X 200MM X 0.2MM;

402030403020

Wurth Elektronik
HEAT SINK PAD, 400MM X 300MM X 0.2MM;

402150101020

Wurth Elektronik
HEAT SINK PAD, 100MM X 100MM X 0.2MM;