OVP and EMI Protected, Precision, Low Noise and Bias Current Single Op Amp Features: Low offset voltage: 60 μV maximum at 25°C (8-lead and 14-lead SOIC) Low offset voltage drift: 1 μV/°C maximum (8-lead and 14-lead SOIC) Low input bias current: 1 nA maximum at 25°C Low voltage noise density: 8 nV/√Hz typical at 1 kHz Large signal voltage gain (AVO): 100 dB minimum over full supply voltage and operating temperature Input overvoltage protection to 32 V above and below the supply voltage rail Integrated EMI filter 70 dB typical rejection at 1000 MHz 90 dB typical rejection at 2400 MHz Rail-to-rail output swing Low supply current: 500 μA typical per amplifier Wide bandwidth Gain bandwidth product (AV = 100): 3.5 MHz typical Unity-gain crossover (AV = 1): 3.5 MHz typical −3 dB bandwidth (AV = 1): 6 MHz typical Dual-supply operation Specified at ±5 V to ±15 V, operates over ±2.5 V to ±18 V Unity-gain stable No phase reversal Long-term offset voltage drift (10,000 hours): 2 μV typical Temperature hysteresis: 2 μV typical

Zero Drift, High Voltage, Low Power, Programmable Gain Instrumentation Amplifier Features: Optimized for ADC synchronization Low power: 22 mW (±12 V supplies) 12 binary gain steps from 1/16 V/V to 128 V/V 3 scaling gains: 1 V/V, 1.25 V/V, and 1.375 V/V ±60 V protected input multiplexer Excellent dc precision Low input offset voltage: ±14 μV maximum Low input offset voltage drift: ±0.08 μV/°C maximum Gain calibration via ROM Low gain drift: ±1 ppm/°C maximum High CMRR: 116 dB minimum, G = 1 V/V Low input bias current: ±1.5 nA maximum High input impedance Integrated input EMI filtering Wide input supply range: ±5 V to ±28 V Dedicated output amplifier supplies 7 GPIO ports with special functions Sequential chip select mode External multiplexer control Excitation current sources SPI port with checksum (CRC) support Internal fault detection Wire break test currents On-chip test multiplexer 28-lead, 5 mm × 5 mm LFCSP, 24-lead TSSOP Specified temperature range: −40°C to +105°C

16-Bit, 15 MSPS, Module Data Acquisition Solution Features: Integrated fully differential ADC driver with signal scaling Wide input common range High common-mode rejection Single-ended to differential conversion 2.048 V input range with 4.096 V REFBUF Critical passive components 0.005% precision matched resistor array for FDA 9 mm × 9 mm, 0.8 mm pitch, 100-ball BGA package 4× footprint reduction versus discrete solution Low power, dynamic power scaling, power-down mode 143 mW typical at 15 MSPS Throughput: 15 MSPS, no pipeline delay INL: 0.4 LSB typical, 1 LSB maximum SINAD: 89 dB typical at 1 kHz THD: 115 dB at 1 kHz, 106 dB at 400 kHz Gain error: 0.005% FS typical Gain error drift: 1 ppm/C maximum On-board reference buffer with VCMO generation Serial LVDS interface Wide operating temperature range: 40C to +85C

10 GHz to 40 GHz, 1:4 Channel, 4 Frequency Multiplier/Filter Features: 4 input frequency multiplier with programmable harmonic filter Quad Differential Output PAs with independent Enable Control Input Frequency Range: 2.5 GHz to 10 GHz Output Frequency Range: 10 GHz to 40 GHz Input power: 20 dBm (50 ) Output power: 5 dBm differential (100 ) Harmonic rejection: 20 dBc to 40 dBc at all frequencies 3-Wire or 4-Wire SPI Control of all functions On-Chip Programmable State Machines for fast multiplier/filter and transmitter switching and control On-chip temperature sensor, output power detectors, and ADC DC power: 450 mW (2.5 V supply) 6 mm 6 mm, 40-terminal LGA package

0.5 GHz to 19 GHz Broadband Bi-Directional Single Channel True Time Delay Unit Features:0.5 GHz to 19 GHz frequency rangeProgrammable Time Delay: 7-bit resolutionProgrammable Time Delay ModesTD_Mode0: 0 to 508ps range, 4ps Standard resolutionTD_Mode1: 0 to 254ps range, 2ps High resolutionProgrammable Attenuation: 6-bit resolution31.5 dB adjustment range0.5 dB step sizeFully programmable via a 3-wire or 4-wire SPI interfaceSPI Programmable and Daisy Chaining selectablePower Dissipation: 1 mW with 1.2V and 1.0V Dual Supplies14-pin 2x3mm LFCSP

Ultra Low Power ARM Cortex-M4F MCU with Integrated Power Management Features: EEMBC ULPMark™-CP score (3 V): 189 Ultra low power active and hibernate modes Active mode dynamic current: 41 μA/MHz (typical) Flexi mode: 400 μA (typical) Hibernate mode: 0.65 μA (typical) Shutdown mode: 50 nA (typical) Shutdown mode (fast wake-up): 0.20 μA (typical) ARM Cortex-M4F processor at 52 MHz with FPU, MPU, ITM with SWD interface Power management Single-supply operation (connected to VBAT pins): 1.74 V to 3.6 V Optional buck converter for improved efficiency Memory options 512 kB of embedded flash memory with ECC 4 kB of cache memory to reduce active power 128 kB of configurable system SRAM with parity Safety Watchdog with dedicated on-chip oscillator Hardware CRC with programmable polynomial Multiparity bit protected SRAM ECC protected embedded flash Security Hardware cryptographic accelerator supporting AES-128, AES-256, and SHA-256 Protected key storage in flash, SHA-256-based keyed HMAC and key wrap and unwrap User code protection TRNG Digital peripherals 3 SPI interfaces to enable glueless interface to sensors, radios, and converters 1 I2C and 2 UART peripheral interfaces SPORT for natively interfacing with converters and radios Programmable GPIOs (44 in LFCSP and 51 in WLCSP) 3 general-purpose timers with PWM support RGB timer for driving RGB LED RTC0 for time keeping RTC1 with SensorStrobe and time stamping Programmable beeper 27-channel DMA controller Clocking features 26 MHz clock: on-chip oscillator, external crystal oscillator, SYS_CLKIN for external clock, and integrated PLL 32 kHz clock: on-chip oscillator and low power crystal oscillator Clock fail detection for external crystals Analog peripherals 12-bit SAR ADC, 1.8 MSPS, 8 channels, and digital comparator

Precision Analog Microcontroller, 16-Bit Analog Input/Output with MDIO Interface, Arm Cortex-M33 Features: Analog input/output Multichannel, 16-bit, 2 MSPS ADC Up to 16 external channels On-chip die temperature monitor 4 power monitor channels 4 PGA/TIA channels supporting voltage and current measurements Fully differential and single-ended modes 0 V to VREF analog input range 12-bit voltage output DACs 8× 0 V to 2.5 V, 1 kΩ load 4× 0 V to 2.5 V, 2.5 kΩ load On-chip low drift voltage reference, 1.25 V or 2.5 V Buffered 1.25 V or 2.5 V output 4 voltage comparators Microcontroller 32-bit Arm Cortex-M33 core, 32-bit RISC architecture, FPU Serial wire port supports code download and debug Clocking options 16 MHz on-chip oscillator 160 MHz PLL output with programmable divider External clock source Memory 2× 512 kB independent Flash/EE memories 10,000-cycle Flash/EE endurance 20-year Flash/EE retention 128 kB SRAM with ECC Software triggered, in circuit reprogrammability via MDIO or I2C On-chip peripherals 2× UART, 3× SPI, 3× I2C serial input/output Multilevel voltage (3.3 V, 1.8 V, 1.2 V) GPIOs MDIO slave up to 10 MHz 5 general-purpose timers Wake-up timer (WUTs) Watchdog timers (WDTs) 32-element PLA 16-bit PWM 10 external Interrupts Power Multiple supplies: 3.3 V for voltage DACs and ADCs, and 3.3 V, 1.8 V, or 1.2 V for digital inputs/outputs Flexible operating modes for low power applications Packages and temperature range 5 mm × 5 mm 81-ball CSP_BGA and 3.46 mm × 3.46 mm 64-ball WLCSP BGA package uses ULA molding compounds Fully specified for −40°C to +105°C operation Tools Low cost quick start development system Full third-party support  

Precision Analog Microcontroller, 16-Bit Analog Input/Output with MDIO Interface, Arm Cortex-M33 Features: Analog input/output Multichannel, 16-bit, 2 MSPS ADC Up to 16 external channels On-chip die temperature monitor 4 power monitor channels 4 PGA/TIA channels supporting voltage and current measurements Fully differential and single-ended modes 0 V to VREF analog input range 12-bit voltage output DACs 8× 0 V to 2.5 V, 1 kΩ load 4× 0 V to 2.5 V, 2.5 kΩ load On-chip low drift voltage reference, 1.25 V or 2.5 V Buffered 1.25 V or 2.5 V output 4 voltage comparators Microcontroller 32-bit Arm Cortex-M33 core, 32-bit RISC architecture, FPU Serial wire port supports code download and debug Clocking options 16 MHz on-chip oscillator 160 MHz PLL output with programmable divider External clock source Memory 2× 512 kB independent Flash/EE memories 10,000-cycle Flash/EE endurance 20-year Flash/EE retention 128 kB SRAM with ECC Software triggered, in circuit reprogrammability via MDIO or I2C On-chip peripherals 2× UART, 3× SPI, 3× I2C serial input/output Multilevel voltage (3.3 V, 1.8 V, 1.2 V) GPIOs MDIO slave up to 10 MHz 5 general-purpose timers Wake-up timer (WUTs) Watchdog timers (WDTs) 32-element PLA 16-bit PWM 10 external Interrupts Power Multiple supplies: 3.3 V for voltage DACs and ADCs, and 3.3 V, 1.8 V, or 1.2 V for digital inputs/outputs Flexible operating modes for low power applications Packages and temperature range 5 mm × 5 mm 81-ball CSP_BGA and 3.46 mm × 3.46 mm 64-ball WLCSP BGA package uses ULA molding compounds Fully specified for −40°C to +105°C operation Tools Low cost quick start development system Full third-party support  

3.0 kV rms, Dual-Channel Digital Isolators Features: High common-mode transient immunity: 100 kV/µs typical High robustness to radiated and conducted noise Low propagation delay 13 ns maximum for 5 V operation 15 ns maximum for 1.8 V operation 150 Mbps minimum data rate Safety and regulatory approvals UL recognition: 3000 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice 5A VDE certificate of conformity DIN VDE V 0884-11:2017-01 VIORM = 565 V peak CQC certification per GB4943.1-2011 Backward compatibility ADuM120N0 pin-compatible with ADuM1285 ADuM120N1 pin-compatible with ADuM1280 and ADuM1200 ADuM121N0 pin-compatible with ADuM1286 ADuM121N1 pin-compatible with ADuM1281 and ADuM1201 Low dynamic power consumption 1.8 V to 5 V level translation High temperature operation: 125°C Failsafe high or low options 8-lead, RoHS-compliant, SOIC package Qualified for automotive applications

Micropower, Dual-Channel Digital Isolators, Default High (2/0 Channel Directionality) Features: Ultralow power operation 3.3 V operation 6 μA per channel quiescent current, refresh enabled 0.3 μA per channel quiescent current, refresh disabled 148 μA/Mbps per channel typical dynamic current 2.5 V operation 3 μA per channel quiescent current, refresh enabled 0.1 μA per channel quiescent current, refresh disabled Quad-channel products available See datasheet for additional features