14-Bit, 1300 MSPS/625 MSPS, JESD204B, Dual Analog-to-Digital Converter Features: JESD204B (Subclass 1) coded serial digital outputs Lane rates up to 16 Gbps 1.6 W total power at 1300 MSPS 800 mW per ADC channel SNR = 65.6 dBFS at 172 MHz (1.59 VP-P input range) SFDR = 78 dBFS at 172.3 MHz (1.59 VP-P input range) Noise density −153.9 dBFS/Hz (1.59 VP-P input range) −155.6 dBFS/Hz (2.04 VP-P input range) 0.95 V, 1.8 V, and 2.5 V supply operation No missing codes Internal ADC voltage reference Flexible input range 1.36 VP-P to 2.04 VP-P (1.59 VP-P typical) 2 GHz usable analog input full power bandwidth >95 dB channel isolation/crosstalk Amplitude detect bits for efficient AGC implementation 2 integrated digital downconverters per ADC channel 48-bit NCO Programmable decimation rates Differential clock input SPI control Integer clock divide by 2 and divide by 4 Flexible JESD204B lane configurations On-chip dithering to improve small signal linearity

12-Bit, 210 MSPS TxDAC D/A Converter Features: High performance member of pin-compatible TxDAC product family Excellent spurious-free dynamic range performance SNR at 5 MHz output, 125 MSPS: 70 dB Twos complement or straight binary data format Differential current outputs: 2 mA to 20 mA Power dissipation: 135 mW at 3.3 V Power-down mode: 15 mW at 3.3 V On-chip 1.2 V Reference CMOS compatible digital interface 28-lead SOIC, 28-lead TSSOP, and 32-lead LFCSP Edge-triggered latches

Low Cost JFET Input Operational Amplifier Features: TL082/TL084 compatible Low input bias current: 10 pA maximum Offset voltage 5.5 mV maximum (ADTL082A/ADTL084A) 9 mV maximum (ADTL082J/ADTL084J) ±15 V operation Low noise: 16 nV/√Hz Wide bandwidth: 5 MHz Slew rate: 20 V/μs CMRR: 80 dB minimum Total harmonic distortion: 0.001% Supply current: 1.2 mA typical Unity-gain stable

Ultra Low Power ARM Cortex-M4F MCU with Integrated Power Management Features: EEMBC ULPMark™-CP score (3 V): 189 Ultra low power active and hibernate modes Active mode dynamic current: 41 μA/MHz (typical) Flexi mode: 400 μA (typical) Hibernate mode: 0.65 μA (typical) Shutdown mode: 50 nA (typical) Shutdown mode (fast wake-up): 0.20 μA (typical) ARM Cortex-M4F processor at 52 MHz with FPU, MPU, ITM with SWD interface Power management Single-supply operation (connected to VBAT pins): 1.74 V to 3.6 V Optional buck converter for improved efficiency Memory options 512 kB of embedded flash memory with ECC 4 kB of cache memory to reduce active power 128 kB of configurable system SRAM with parity Safety Watchdog with dedicated on-chip oscillator Hardware CRC with programmable polynomial Multiparity bit protected SRAM ECC protected embedded flash Security Hardware cryptographic accelerator supporting AES-128, AES-256, and SHA-256 Protected key storage in flash, SHA-256-based keyed HMAC and key wrap and unwrap User code protection TRNG Digital peripherals 3 SPI interfaces to enable glueless interface to sensors, radios, and converters 1 I2C and 2 UART peripheral interfaces SPORT for natively interfacing with converters and radios Programmable GPIOs (44 in LFCSP and 51 in WLCSP) 3 general-purpose timers with PWM support RGB timer for driving RGB LED RTC0 for time keeping RTC1 with SensorStrobe and time stamping Programmable beeper 27-channel DMA controller Clocking features 26 MHz clock: on-chip oscillator, external crystal oscillator, SYS_CLKIN for external clock, and integrated PLL 32 kHz clock: on-chip oscillator and low power crystal oscillator Clock fail detection for external crystals Analog peripherals 12-bit SAR ADC, 1.8 MSPS, 8 channels, and digital comparator

Precision Analog Microcontroller, 16-Bit Analog Input/Output with MDIO Interface, Arm Cortex-M33 Features: Analog input/output Multichannel, 16-bit, 2 MSPS ADC Up to 16 external channels On-chip die temperature monitor 4 power monitor channels 4 PGA/TIA channels supporting voltage and current measurements Fully differential and single-ended modes 0 V to VREF analog input range 12-bit voltage output DACs 8× 0 V to 2.5 V, 1 kΩ load 4× 0 V to 2.5 V, 2.5 kΩ load On-chip low drift voltage reference, 1.25 V or 2.5 V Buffered 1.25 V or 2.5 V output 4 voltage comparators Microcontroller 32-bit Arm Cortex-M33 core, 32-bit RISC architecture, FPU Serial wire port supports code download and debug Clocking options 16 MHz on-chip oscillator 160 MHz PLL output with programmable divider External clock source Memory 2× 512 kB independent Flash/EE memories 10,000-cycle Flash/EE endurance 20-year Flash/EE retention 128 kB SRAM with ECC Software triggered, in circuit reprogrammability via MDIO or I2C On-chip peripherals 2× UART, 3× SPI, 3× I2C serial input/output Multilevel voltage (3.3 V, 1.8 V, 1.2 V) GPIOs MDIO slave up to 10 MHz 5 general-purpose timers Wake-up timer (WUTs) Watchdog timers (WDTs) 32-element PLA 16-bit PWM 10 external Interrupts Power Multiple supplies: 3.3 V for voltage DACs and ADCs, and 3.3 V, 1.8 V, or 1.2 V for digital inputs/outputs Flexible operating modes for low power applications Packages and temperature range 5 mm × 5 mm 81-ball CSP_BGA and 3.46 mm × 3.46 mm 64-ball WLCSP BGA package uses ULA molding compounds Fully specified for −40°C to +105°C operation Tools Low cost quick start development system Full third-party support  

Precision Analog Microcontroller, 16-Bit Analog Input/Output with MDIO Interface, Arm Cortex-M33 Features: Analog input/output Multichannel, 16-bit, 2 MSPS ADC Up to 16 external channels On-chip die temperature monitor 4 power monitor channels 4 PGA/TIA channels supporting voltage and current measurements Fully differential and single-ended modes 0 V to VREF analog input range 12-bit voltage output DACs 8× 0 V to 2.5 V, 1 kΩ load 4× 0 V to 2.5 V, 2.5 kΩ load On-chip low drift voltage reference, 1.25 V or 2.5 V Buffered 1.25 V or 2.5 V output 4 voltage comparators Microcontroller 32-bit Arm Cortex-M33 core, 32-bit RISC architecture, FPU Serial wire port supports code download and debug Clocking options 16 MHz on-chip oscillator 160 MHz PLL output with programmable divider External clock source Memory 2× 512 kB independent Flash/EE memories 10,000-cycle Flash/EE endurance 20-year Flash/EE retention 128 kB SRAM with ECC Software triggered, in circuit reprogrammability via MDIO or I2C On-chip peripherals 2× UART, 3× SPI, 3× I2C serial input/output Multilevel voltage (3.3 V, 1.8 V, 1.2 V) GPIOs MDIO slave up to 10 MHz 5 general-purpose timers Wake-up timer (WUTs) Watchdog timers (WDTs) 32-element PLA 16-bit PWM 10 external Interrupts Power Multiple supplies: 3.3 V for voltage DACs and ADCs, and 3.3 V, 1.8 V, or 1.2 V for digital inputs/outputs Flexible operating modes for low power applications Packages and temperature range 5 mm × 5 mm 81-ball CSP_BGA and 3.46 mm × 3.46 mm 64-ball WLCSP BGA package uses ULA molding compounds Fully specified for −40°C to +105°C operation Tools Low cost quick start development system Full third-party support  

3.0 kV rms, Dual-Channel Digital Isolators Features: High common-mode transient immunity: 100 kV/µs typical High robustness to radiated and conducted noise Low propagation delay 13 ns maximum for 5 V operation 15 ns maximum for 1.8 V operation 150 Mbps minimum data rate Safety and regulatory approvals UL recognition: 3000 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice 5A VDE certificate of conformity DIN VDE V 0884-11:2017-01 VIORM = 565 V peak CQC certification per GB4943.1-2011 Backward compatibility ADuM120N0 pin-compatible with ADuM1285 ADuM120N1 pin-compatible with ADuM1280 and ADuM1200 ADuM121N0 pin-compatible with ADuM1286 ADuM121N1 pin-compatible with ADuM1281 and ADuM1201 Low dynamic power consumption 1.8 V to 5 V level translation High temperature operation: 125°C Failsafe high or low options 8-lead, RoHS-compliant, SOIC package Qualified for automotive applications

Micropower, Dual-Channel Digital Isolators, Default High (2/0 Channel Directionality) Features: Ultralow power operation 3.3 V operation 6 μA per channel quiescent current, refresh enabled 0.3 μA per channel quiescent current, refresh disabled 148 μA/Mbps per channel typical dynamic current 2.5 V operation 3 μA per channel quiescent current, refresh enabled 0.1 μA per channel quiescent current, refresh disabled Quad-channel products available See datasheet for additional features

3kV rms, Default Low, Dual-Channel Digital Isolators (2/0 Channel Directionality) Features: Up to 100 Mbps data rate (NRZ) Low propagation delay: 23 ns typical Low dynamic power consumption Bidirectional communication 3.3 V to 5 V level translation High temperature operation: 125°C High common-mode transient immunity: >25 kV/μs Default high output: ADuM1280/ADuM1281 Default low output: ADuM1285/ADuM1286 Narrow body, RoHS-compliant, 8-lead SOIC Safety and regulatory approvals UL recognition: 3000 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice 5A VDE Certificate of Conformity DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12 VIORM = 560 V peak Qualified for automotive applications

Quad-Channel Digital Isolator (3/1 Channel Directionality) Features: Qualified for automotive applications Low power operation Bidirectional communication 3 V/5 V level translation High temperature operation: 125°C High data rate: dc to 90 Mbps (NRZ) Precise timing characteristics High common-mode transient immunity: >25 kV/μs See data sheet for additional features