Up to 1 GHz Dual-SHARC+ DSP w/ Integrated Arm Cortex-A5 Features:SHARC+ Core Infrastructure 800 MHz (max) or 1 GHz (max) Core clock frequency 2x 640KB on-chip Level 1 (L1) SRAM memory (with parity) increases low latency performance 32-bit, 40-bit & 64-bit floating point support 32-bit fixed point Byte, short-word, word, long-word addressedArm Core Infrastructure: 1 GHz Arm Cortex-A5 (with Neon/FPU) 32 kByte/32 kByte L1 Instr./Data Cache 256 kByte L2 CacheMemory 2048 KB on-chip Level 2 (L2) SRAM with ECC protection - eliminates need for external memory in many use cases Level 3 (L3) interface optimized for low system power, providing 16-bit interface to DDR3 (supporting 1.35 V capable DDR3L devices)16-bit DDR/DDR3L Memory Controller 1.35V support for DDR3LAdvanced Hardware Accelerators Enhanced FIR/IIR offload engines running at Core clock frequency for added processing power Security Crypto Engines with OTPPowerful DMA SystemInnovative Digital Audio Interface (DAI) includes: 8x Full SPORT interfaces w/TDM & I2S modes 2x S/PDIF Rx/Tx, 8 ASRC pairs 8x Precision Clock Generators 2x 4-channel PDM Mic Inputs 40 BuffersOther Peripheral Connectivity / Interfaces: 2x Quad SPI, 1x Octal SPI MLB 3-pin / 6-pin 6x I2C,3x UARTs 2x Link Ports 16x General Purpose Timer, 1x General Purpose Counter 3x Watchdog Timers ePPI USB 2.0 HS OTG Controller 10/100 EMAC 10/100/1000 EMAC w/AVB and 1588 2x CAN FD 8-ch 12bit Housekeeping ADC 135 GPIO pins, 40 DAI pins Thermal SensorPackage 17mm x 17mm (0.8mm pitch) 400-ball FCBGAAdditional Features Security and Protection Crypto hardware accelerators Fast secure boot with IP protection Enhanced FIR and IIR accelerators running up to 1 GHz AEC-Q100 qualified for automotive applications

10 W (40 dBm), 0.01 GHz to 1.1 GHz, GaN Power Amplifier Features: High small signal gain: 20 dB typical POUT: 41.5 dBm typical at PIN = 27 dBm High PAE: 60% typical at PIN = 27 dBm Instantaneous bandwidth: 0.01 GHz to 1.1 GHz across all frequencies Supply voltage: VDD = 28 V at a quiescent current of 100 mA Internal prematching Simple and compact external tuning for optimal performance 5 mm × 5 mm, 32-lead LFCSP

GaAs MMIC DBL-BAL Mixer, 3.5 - 8 GHz Features: Passive Double-Balanced Topology Input IP3 : +17 dBm Low Conversion Loss: 7 dB LO / RF Isolation: 38 dB LO / IF Isolation: 32 dB Upconverter & Downconverter Applications

Low Noise Amplifier SMT, 350 - 550 MHz Features: Noise Figure: ≤1 dB Output IP3: +38 dBm Gain: 17 dB Very Stable Gain vs. Supply & Temp Single Supply: +5V @ 104 mA 50 Ohm Matched Output

Medium Power Amplifier SMT, 5 - 20 GHz Features: Gain: 19 dB Saturated Power: +21 dBm @ 21% PAE Output IP3: +30 dBm Single Supply: +5V @ 114 mA 50 Ohm Matched Input/Output RoHS Compliant 3x3 mm SMT package

GaAs pHEMT MMIC Low Noise Amplifier, DC - 20 GHz Features: Noise Figure: 2.5 dB @ 10 GHz Gain: 14 dB @ 10 GHz P1dB Output Power: +16.5 dBm @ 10 GHz Supply Voltage: +8V @ 75 mA 50 Ohm Matched Input/Output 32 Lead Ceramic 5 x 5 mm SMT Package: 25 mm2

1 dB LSB GaAs MMIC 3-Bit Digital Positive Control Attenuator, DC-6 GHz Features: 1 dB LSB Steps to 7 dB High IP3: +55 dBm ±0.25 dB Typical Bit Error Single Control Line Per Bit Single +5V Supply 16 Lead 3×3 mm SMT Package: 9 mm2

VCO SMT with Fo/2 & Divide-by-4, 8.45 - 9.55 GHz Features: Dual Output: Fo = 8.45 - 9.55 GHz Fo/2 = 4.225 - 4.775 GHz Phase Noise: -116 dBc/Hz @100 kHz Typ. Pout: +13 dBm No External Resonator Needed QFN Leadless SMT Package, 25 mm2

GaAs, pHEMT, MMIC, 1 W, Power Amplifier with Power Detector, 37 GHz to 40 GHz Features: 32 dBm typical saturated output power (PSAT) at 18% power added efficiency (PAE) at 39 GHz P1dB compression output power: 31.5 dBm typical High output third-order intercept (IP3): 40 dBm typical High gain: 24 dB typical 50 Ω matched input/output Ceramic, 6 mm × 6 mm, high frequency, air cavity package

26 GHz, T Flip-Flop w/Reset Features: Supports Clock Frequencies up to 26 GHz Differential & Singe-Ended Operation Fast Rise and Fall Times: 18/17 ps Low Power Consumption: 270 mW typ. Propagation Delay: 95 ps Single Supply: -3.3V 16 Lead Ceramic 3×3mm SMT Package: 9mm2