Ultra Low Power ARM Cortex-M4F MCU with Integrated Power Management Features: EEMBC ULPMark™-CP score (3 V): 189 Ultra low power active and hibernate modes Active mode dynamic current: 41 μA/MHz (typical) Flexi mode: 400 μA (typical) Hibernate mode: 0.65 μA (typical) Shutdown mode: 50 nA (typical) Shutdown mode (fast wake-up): 0.20 μA (typical) ARM Cortex-M4F processor at 52 MHz with FPU, MPU, ITM with SWD interface Power management Single-supply operation (connected to VBAT pins): 1.74 V to 3.6 V Optional buck converter for improved efficiency Memory options 512 kB of embedded flash memory with ECC 4 kB of cache memory to reduce active power 128 kB of configurable system SRAM with parity Safety Watchdog with dedicated on-chip oscillator Hardware CRC with programmable polynomial Multiparity bit protected SRAM ECC protected embedded flash Security Hardware cryptographic accelerator supporting AES-128, AES-256, and SHA-256 Protected key storage in flash, SHA-256-based keyed HMAC and key wrap and unwrap User code protection TRNG Digital peripherals 3 SPI interfaces to enable glueless interface to sensors, radios, and converters 1 I2C and 2 UART peripheral interfaces SPORT for natively interfacing with converters and radios Programmable GPIOs (44 in LFCSP and 51 in WLCSP) 3 general-purpose timers with PWM support RGB timer for driving RGB LED RTC0 for time keeping RTC1 with SensorStrobe and time stamping Programmable beeper 27-channel DMA controller Clocking features 26 MHz clock: on-chip oscillator, external crystal oscillator, SYS_CLKIN for external clock, and integrated PLL 32 kHz clock: on-chip oscillator and low power crystal oscillator Clock fail detection for external crystals Analog peripherals 12-bit SAR ADC, 1.8 MSPS, 8 channels, and digital comparator

Precision Analog Microcontroller, 16-Bit Analog Input/Output with MDIO Interface, Arm Cortex-M33 Features: Analog input/output Multichannel, 16-bit, 2 MSPS ADC Up to 16 external channels On-chip die temperature monitor 4 power monitor channels 4 PGA/TIA channels supporting voltage and current measurements Fully differential and single-ended modes 0 V to VREF analog input range 12-bit voltage output DACs 8× 0 V to 2.5 V, 1 kΩ load 4× 0 V to 2.5 V, 2.5 kΩ load On-chip low drift voltage reference, 1.25 V or 2.5 V Buffered 1.25 V or 2.5 V output 4 voltage comparators Microcontroller 32-bit Arm Cortex-M33 core, 32-bit RISC architecture, FPU Serial wire port supports code download and debug Clocking options 16 MHz on-chip oscillator 160 MHz PLL output with programmable divider External clock source Memory 2× 512 kB independent Flash/EE memories 10,000-cycle Flash/EE endurance 20-year Flash/EE retention 128 kB SRAM with ECC Software triggered, in circuit reprogrammability via MDIO or I2C On-chip peripherals 2× UART, 3× SPI, 3× I2C serial input/output Multilevel voltage (3.3 V, 1.8 V, 1.2 V) GPIOs MDIO slave up to 10 MHz 5 general-purpose timers Wake-up timer (WUTs) Watchdog timers (WDTs) 32-element PLA 16-bit PWM 10 external Interrupts Power Multiple supplies: 3.3 V for voltage DACs and ADCs, and 3.3 V, 1.8 V, or 1.2 V for digital inputs/outputs Flexible operating modes for low power applications Packages and temperature range 5 mm × 5 mm 81-ball CSP_BGA and 3.46 mm × 3.46 mm 64-ball WLCSP BGA package uses ULA molding compounds Fully specified for −40°C to +105°C operation Tools Low cost quick start development system Full third-party support  

Precision Analog Microcontroller, 16-Bit Analog Input/Output with MDIO Interface, Arm Cortex-M33 Features: Analog input/output Multichannel, 16-bit, 2 MSPS ADC Up to 16 external channels On-chip die temperature monitor 4 power monitor channels 4 PGA/TIA channels supporting voltage and current measurements Fully differential and single-ended modes 0 V to VREF analog input range 12-bit voltage output DACs 8× 0 V to 2.5 V, 1 kΩ load 4× 0 V to 2.5 V, 2.5 kΩ load On-chip low drift voltage reference, 1.25 V or 2.5 V Buffered 1.25 V or 2.5 V output 4 voltage comparators Microcontroller 32-bit Arm Cortex-M33 core, 32-bit RISC architecture, FPU Serial wire port supports code download and debug Clocking options 16 MHz on-chip oscillator 160 MHz PLL output with programmable divider External clock source Memory 2× 512 kB independent Flash/EE memories 10,000-cycle Flash/EE endurance 20-year Flash/EE retention 128 kB SRAM with ECC Software triggered, in circuit reprogrammability via MDIO or I2C On-chip peripherals 2× UART, 3× SPI, 3× I2C serial input/output Multilevel voltage (3.3 V, 1.8 V, 1.2 V) GPIOs MDIO slave up to 10 MHz 5 general-purpose timers Wake-up timer (WUTs) Watchdog timers (WDTs) 32-element PLA 16-bit PWM 10 external Interrupts Power Multiple supplies: 3.3 V for voltage DACs and ADCs, and 3.3 V, 1.8 V, or 1.2 V for digital inputs/outputs Flexible operating modes for low power applications Packages and temperature range 5 mm × 5 mm 81-ball CSP_BGA and 3.46 mm × 3.46 mm 64-ball WLCSP BGA package uses ULA molding compounds Fully specified for −40°C to +105°C operation Tools Low cost quick start development system Full third-party support  

3.0 kV rms, Dual-Channel Digital Isolators Features: High common-mode transient immunity: 100 kV/µs typical High robustness to radiated and conducted noise Low propagation delay 13 ns maximum for 5 V operation 15 ns maximum for 1.8 V operation 150 Mbps minimum data rate Safety and regulatory approvals UL recognition: 3000 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice 5A VDE certificate of conformity DIN VDE V 0884-11:2017-01 VIORM = 565 V peak CQC certification per GB4943.1-2011 Backward compatibility ADuM120N0 pin-compatible with ADuM1285 ADuM120N1 pin-compatible with ADuM1280 and ADuM1200 ADuM121N0 pin-compatible with ADuM1286 ADuM121N1 pin-compatible with ADuM1281 and ADuM1201 Low dynamic power consumption 1.8 V to 5 V level translation High temperature operation: 125°C Failsafe high or low options 8-lead, RoHS-compliant, SOIC package Qualified for automotive applications

Quad-Channel Digital Isolator (3/1 Channel Directionality) Features: Qualified for automotive applications Low power operation Bidirectional communication 3 V/5 V level translation High temperature operation: 125°C High data rate: dc to 90 Mbps (NRZ) Precise timing characteristics High common-mode transient immunity: >25 kV/μs See data sheet for additional features

Triple-Channel, Digital Isolator, Enhanced System-Level ESD Reliability (2/1 channel directionality) Features: Enhanced system-level ESD performance per IEC 61000-4-x Low power operation 5 V operation 2.0 mA per channel maximum at 0 Mbps to 2 Mbps 4.1 mA per channel maximum at 10 Mbps 36 mA per channel maximum at 90 Mbps 3.3 V operation 1.0 mA per channel maximum at 0 Mbps to 2 Mbps 2.8 mA per channel maximum at 10 Mbps 17 mA per channel maximum at 90 Mbps Bidirectional communication 3.3 V/5 V level translation High temperature operation: 105°C High data rate: dc to 90 Mbps (NRZ) Precise timing characteristics 2 ns maximum pulse width distortion 2 ns maximum channel-to-channel matching High common-mode transient immunity: >25 kV/μs Output enable function 16-lead SOIC wide body, RoHS-compliant package Safety and regulatory approvals UL recognition: 2500 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice 5A VDE Certificate of Conformity DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12 VIORM = 560 V peak CQC Certification per GB4943.1-2011

14-Bit, 1300 MSPS/625 MSPS, JESD204B, Dual Analog-to-Digital Converter Features: JESD204B (Subclass 1) coded serial digital outputs Lane rates up to 16 Gbps 1.6 W total power at 1300 MSPS 800 mW per ADC channel SNR = 65.6 dBFS at 172 MHz (1.59 VP-P input range) SFDR = 78 dBFS at 172.3 MHz (1.59 VP-P input range) Noise density −153.9 dBFS/Hz (1.59 VP-P input range) −155.6 dBFS/Hz (2.04 VP-P input range) 0.95 V, 1.8 V, and 2.5 V supply operation No missing codes Internal ADC voltage reference Flexible input range 1.36 VP-P to 2.04 VP-P (1.59 VP-P typical) 2 GHz usable analog input full power bandwidth >95 dB channel isolation/crosstalk Amplitude detect bits for efficient AGC implementation 2 integrated digital downconverters per ADC channel 48-bit NCO Programmable decimation rates Differential clock input SPI control Integer clock divide by 2 and divide by 4 Flexible JESD204B lane configurations On-chip dithering to improve small signal linearity

4T2R Direct RF Transmitter and Observation Receiver Features: Flexible reconfigurable radio common platform design Transmit/receive channel bandwidth up to 1.2 GHz/2.4 GHz (4T2R) RFDAC/RFADC RF frequency range up to 7.5 GHz On-chip PLL with multichip synchronization External RFCLK input option Versatile digital features Configurable digital up/down conversion (DDC and DUC) 8 fine complex DUCs and 4 coarse complex DUCs 8 fine complex DDCs and 4 coarse complex DDCs, 2 independent 48-bit NCO per DUC/DDC Programmable 192-tap PFIR filter for receive equalization Supports 4 different profile settings loaded via GPIO Receive AGC support Fast detect with low latency for fast AGC control Signal monitor for slow AGC control Dedicated AGC support pins Transmit DPD support Programmable delay and gain per transmit data path Coarse DDC delay adjust for DPD observation path Auxiliary features Power amplifier downstream protection circuitry On-chip temperature monitoring unit Programmable GPIO pins supporting different user configurations ADC clock driver with selectable divide ratios TDD power savings option and sharing ADCs SERDES JESD204B/JESD204C interface, 16 lanes up to 24.75 Gbps 8 lanes per each DAC and ADC JESD204B compatible with maximum 15.5 Gbps lane rate JESD204C compatible with maximum 24.75 Gbps lane rate Supports real or complex digital data (8-bit, 12-bit, 16-bit, or 24-bit) 15 mm × 15 mm, 324-ball BGA with 0.8 mm pitch

Ultrathin 1.5A Module Thermoelectric Cooler (TEC) Regulator Features:Built-in Two Zero-Drift, Rail-to-Rail Chopper Amplifiers2.7V to 5.5V Input Voltage Range1.5A Driving Capability1% Accuracy 2.5V Internal Reference OutputIndependent Programmable Heating and Cooling Current LimitTEC Voltage and Current MonitoringProgrammable Maximum TEC VoltageDefault 2MHz Switching FrequencySynchronization from 1.85MHz to 3.25MHzCapable of NTC, PTC and RTD Thermal Sensors3.5mm 4mm 1.3mm LGA Package

42V, 5A/7A Peak Synchronous Step-Down Silent Switcher with 2.5A Quiescent Current Features: Silent Switcher® Architecture Ultralow EMI Emissions Optional Spread Spectrum Modulation High Efficiency at High Frequency Up to 96% Efficiency at 1MHz, 12VIN to 5VOUT Up to 95% Efficiency at 2MHz, 12VIN to 5VOUT Wide Input Voltage Range: 3.4V to 42V 5A Maximum Continuous, 7A Peak Transient Output Ultralow Quiescent Current Burst Mode® Operation 2.5µA IQ Regulating 12VIN to 3.3VOUT Output Ripple < 10mVP-P Fast Minimum Switch On-Time: 30ns Low Dropout Under All Conditions: 100mV at 1A Forced Continuous Mode Adjustable and Synchronizable: 200kHz to 3MHz Output Soft-Start and Power Good Small 20-Lead 4mm × 3mm LQFN Package AEC-Q100 Qualified for Automotive Applications