Dual Channel 2A, 42V,Synchronous Step-Down Silent Switcher 2with 6.2A Quiescent Current Features: Silent Switcher®2 Architecture: Ultralow EMI on Any PCB Eliminates PCB Layout Sensitivity Internal Bypass Capacitors Reduce Radiated EMI Optional Spread Spectrum Modulation 2A DC from Each Channel Simultaneously Up to 3A on Either Channel Ultralow Quiescent Current Burst Mode® Operation: 6.2μA IQ Regulating 12VIN to 5VOUT1 and 3.3VOUT2 Output Ripple < 10mVP–P Optional External VC Pin: Fast Transient Response Forced Continuous Mode High Efficiency at High Frequency 94.1% Efficiency at 1A, 5VOUT from 12VIN at 2MHz Pin-Selectable Fixed Output Voltages: 5V, 3.3V, 1.8V Fast Minimum Switch-On Time: 30ns Wide Input Voltage Range: 3.0V to 42V Adjustable and Synchronizable: 300kHz to 3MHz Fixed Output Pin Strap Options Internal 2MHz fSW with Fast Internal Compensation Small 4mm × 3mm 20-Pin LQFN Package AEC-Q100 Qualified for Automotive Applications

Single Port PoE/PoE+/LTPoE++ PSE Controller Features: Compliant with IEEE 802.3at Type 1 and 2 Supports LTPoE++® Up to 90W Supports Dual-Signature PDs Fully Autonomous Operation without Microcontroller Very Low Power Dissipation 0.1Ω Sense Resistance Low RDS(ON) External MOSFET Very High Reliability 4-Point PD Detection 2-Point Forced Voltage and Forced Current Robust Short-Circuit Protection Cable Surge Protected ±80V OUT pin Classification Dependent ICUT and ILIM Current Thresholds Supports 2-Pair and 4-Pair Output Power UltraPWR Mode Supports Custom PDs up to 123W Pin-Selectable Detection Backoff Timer for Midspans Pin Programmable Legacy PD Detection Pin Programmable Maximum Power Mode Status LED Pin Available in 20-Pin QFN and 16-Pin SO Packages

Ultra Low Power ARM Cortex-M4F MCU with Integrated Power Management Features: EEMBC ULPMark™-CP score (3 V): 189 Ultra low power active and hibernate modes Active mode dynamic current: 41 μA/MHz (typical) Flexi mode: 400 μA (typical) Hibernate mode: 0.65 μA (typical) Shutdown mode: 50 nA (typical) Shutdown mode (fast wake-up): 0.20 μA (typical) ARM Cortex-M4F processor at 52 MHz with FPU, MPU, ITM with SWD interface Power management Single-supply operation (connected to VBAT pins): 1.74 V to 3.6 V Optional buck converter for improved efficiency Memory options 512 kB of embedded flash memory with ECC 4 kB of cache memory to reduce active power 128 kB of configurable system SRAM with parity Safety Watchdog with dedicated on-chip oscillator Hardware CRC with programmable polynomial Multiparity bit protected SRAM ECC protected embedded flash Security Hardware cryptographic accelerator supporting AES-128, AES-256, and SHA-256 Protected key storage in flash, SHA-256-based keyed HMAC and key wrap and unwrap User code protection TRNG Digital peripherals 3 SPI interfaces to enable glueless interface to sensors, radios, and converters 1 I2C and 2 UART peripheral interfaces SPORT for natively interfacing with converters and radios Programmable GPIOs (44 in LFCSP and 51 in WLCSP) 3 general-purpose timers with PWM support RGB timer for driving RGB LED RTC0 for time keeping RTC1 with SensorStrobe and time stamping Programmable beeper 27-channel DMA controller Clocking features 26 MHz clock: on-chip oscillator, external crystal oscillator, SYS_CLKIN for external clock, and integrated PLL 32 kHz clock: on-chip oscillator and low power crystal oscillator Clock fail detection for external crystals Analog peripherals 12-bit SAR ADC, 1.8 MSPS, 8 channels, and digital comparator

Precision Analog Microcontroller, 16-Bit Analog Input/Output with MDIO Interface, Arm Cortex-M33 Features: Analog input/output Multichannel, 16-bit, 2 MSPS ADC Up to 16 external channels On-chip die temperature monitor 4 power monitor channels 4 PGA/TIA channels supporting voltage and current measurements Fully differential and single-ended modes 0 V to VREF analog input range 12-bit voltage output DACs 8× 0 V to 2.5 V, 1 kΩ load 4× 0 V to 2.5 V, 2.5 kΩ load On-chip low drift voltage reference, 1.25 V or 2.5 V Buffered 1.25 V or 2.5 V output 4 voltage comparators Microcontroller 32-bit Arm Cortex-M33 core, 32-bit RISC architecture, FPU Serial wire port supports code download and debug Clocking options 16 MHz on-chip oscillator 160 MHz PLL output with programmable divider External clock source Memory 2× 512 kB independent Flash/EE memories 10,000-cycle Flash/EE endurance 20-year Flash/EE retention 128 kB SRAM with ECC Software triggered, in circuit reprogrammability via MDIO or I2C On-chip peripherals 2× UART, 3× SPI, 3× I2C serial input/output Multilevel voltage (3.3 V, 1.8 V, 1.2 V) GPIOs MDIO slave up to 10 MHz 5 general-purpose timers Wake-up timer (WUTs) Watchdog timers (WDTs) 32-element PLA 16-bit PWM 10 external Interrupts Power Multiple supplies: 3.3 V for voltage DACs and ADCs, and 3.3 V, 1.8 V, or 1.2 V for digital inputs/outputs Flexible operating modes for low power applications Packages and temperature range 5 mm × 5 mm 81-ball CSP_BGA and 3.46 mm × 3.46 mm 64-ball WLCSP BGA package uses ULA molding compounds Fully specified for −40°C to +105°C operation Tools Low cost quick start development system Full third-party support  

Precision Analog Microcontroller, 16-Bit Analog Input/Output with MDIO Interface, Arm Cortex-M33 Features: Analog input/output Multichannel, 16-bit, 2 MSPS ADC Up to 16 external channels On-chip die temperature monitor 4 power monitor channels 4 PGA/TIA channels supporting voltage and current measurements Fully differential and single-ended modes 0 V to VREF analog input range 12-bit voltage output DACs 8× 0 V to 2.5 V, 1 kΩ load 4× 0 V to 2.5 V, 2.5 kΩ load On-chip low drift voltage reference, 1.25 V or 2.5 V Buffered 1.25 V or 2.5 V output 4 voltage comparators Microcontroller 32-bit Arm Cortex-M33 core, 32-bit RISC architecture, FPU Serial wire port supports code download and debug Clocking options 16 MHz on-chip oscillator 160 MHz PLL output with programmable divider External clock source Memory 2× 512 kB independent Flash/EE memories 10,000-cycle Flash/EE endurance 20-year Flash/EE retention 128 kB SRAM with ECC Software triggered, in circuit reprogrammability via MDIO or I2C On-chip peripherals 2× UART, 3× SPI, 3× I2C serial input/output Multilevel voltage (3.3 V, 1.8 V, 1.2 V) GPIOs MDIO slave up to 10 MHz 5 general-purpose timers Wake-up timer (WUTs) Watchdog timers (WDTs) 32-element PLA 16-bit PWM 10 external Interrupts Power Multiple supplies: 3.3 V for voltage DACs and ADCs, and 3.3 V, 1.8 V, or 1.2 V for digital inputs/outputs Flexible operating modes for low power applications Packages and temperature range 5 mm × 5 mm 81-ball CSP_BGA and 3.46 mm × 3.46 mm 64-ball WLCSP BGA package uses ULA molding compounds Fully specified for −40°C to +105°C operation Tools Low cost quick start development system Full third-party support  

3.0 kV rms, Dual-Channel Digital Isolators Features: High common-mode transient immunity: 100 kV/µs typical High robustness to radiated and conducted noise Low propagation delay 13 ns maximum for 5 V operation 15 ns maximum for 1.8 V operation 150 Mbps minimum data rate Safety and regulatory approvals UL recognition: 3000 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice 5A VDE certificate of conformity DIN VDE V 0884-11:2017-01 VIORM = 565 V peak CQC certification per GB4943.1-2011 Backward compatibility ADuM120N0 pin-compatible with ADuM1285 ADuM120N1 pin-compatible with ADuM1280 and ADuM1200 ADuM121N0 pin-compatible with ADuM1286 ADuM121N1 pin-compatible with ADuM1281 and ADuM1201 Low dynamic power consumption 1.8 V to 5 V level translation High temperature operation: 125°C Failsafe high or low options 8-lead, RoHS-compliant, SOIC package Qualified for automotive applications

Micropower, Dual-Channel Digital Isolators, Default High (2/0 Channel Directionality) Features: Ultralow power operation 3.3 V operation 6 μA per channel quiescent current, refresh enabled 0.3 μA per channel quiescent current, refresh disabled 148 μA/Mbps per channel typical dynamic current 2.5 V operation 3 μA per channel quiescent current, refresh enabled 0.1 μA per channel quiescent current, refresh disabled Quad-channel products available See datasheet for additional features

3kV rms, Default Low, Dual-Channel Digital Isolators (2/0 Channel Directionality) Features: Up to 100 Mbps data rate (NRZ) Low propagation delay: 23 ns typical Low dynamic power consumption Bidirectional communication 3.3 V to 5 V level translation High temperature operation: 125°C High common-mode transient immunity: >25 kV/μs Default high output: ADuM1280/ADuM1281 Default low output: ADuM1285/ADuM1286 Narrow body, RoHS-compliant, 8-lead SOIC Safety and regulatory approvals UL recognition: 3000 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice 5A VDE Certificate of Conformity DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12 VIORM = 560 V peak Qualified for automotive applications

Quad-Channel Digital Isolator (3/1 Channel Directionality) Features: Qualified for automotive applications Low power operation Bidirectional communication 3 V/5 V level translation High temperature operation: 125°C High data rate: dc to 90 Mbps (NRZ) Precise timing characteristics High common-mode transient immunity: >25 kV/μs See data sheet for additional features

Robust 5.0 kVrms Six Channel Digital Isolator w/ Fail-Safe & 2 Reverse Channels Features: High common-mode transient immunity: 100 kV/μs High robustness to radiated and conducted noise Low propagation delay 13 ns maximum for 5 V operation 15 ns maximum for 1.8 V operation 150 Mbps maximum guaranteed data rate Safety and regulatory approvals UL recognition: 5000 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice 5A VDE certificate of conformity DIN V VDE V 0884-11:2017-01 VIORM = 849 V peak CQC certification per GB4943.1-2011 Low dynamic power consumption 1.8 V to 5 V level translation High temperature operation: 125°C Fail-safe high or low options 16-lead, RoHS-compliant, wide body SOIC_IC package