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Texas Instruments
THVD1449DR
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Texas Instruments
LP87564TRNFRQ1
|
Texas Instruments
OPA1677DBVT
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Texas Instruments
SN74HCS259QWBQBRQ1
|
Texas Instruments
SN74HCS594QWBQBRQ1
|
Texas Instruments
DAC53204RTER
|
Texas Instruments
TCAN1044ADDFRQ1
|
Texas Instruments
TMAG5170A2EDGKRQ1
|
Texas Instruments
TPS7A03175PYCHR
|
Texas Instruments
TRSF3243EIRHBR
|
| Price |
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| RoHS |
|
Y |
Not Compliant |
Y |
Y |
Y |
Y |
Y |
Y |
Y |
Y |
| Lead Status |
|
Y |
Y |
Y |
Y |
Y |
Y |
Y |
Y |
Y |
Y |
| Common-mode range(V) |
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-12 to 12 |
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| Duplex |
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Half |
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| Fault protection(V) |
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-15 to 15 |
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| Features |
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IEC ESD protection,Surge protection |
Diagnostics,Dynamic voltage scaling,Enable,Enable pin,I2C control,Overcurrent protection,Power good,Power sequencing,Power supply and system monitoring,Spread-Spectrum Clock (SSC) Generation,Thermal shutdown,UVLO fixed |
Small Size |
Partial power down (Ioff),Very high speed (tpd 5-10ns) |
Balanced outputs,High speed (tpd 10-50ns),Output register,Positive input clamp diode |
Cost Optimized,Current Output,Low Power,SDO,Small Size,Smart DAC |
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Enable,Output discharge |
Auto-Powerdown |
| IEC 61000-4-2 contact(V) |
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15000 |
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| Isolated |
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No |
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No |
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| Number of nodes |
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256 |
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| Number of receivers |
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1 |
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| Number of transmitters |
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1 |
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| Operating temperature range(C) |
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-40 |
-40 |
-40 |
-40 |
-40 |
-40 |
-40 to 150 |
-40 |
-40 |
-40 |
| Package area(mm^2) |
|
29.4 |
18 |
8.12 |
8.75 |
8.75 |
9 |
|
14.7 |
0.405769 |
25 |
| Package size (L x W)(mm) |
|
4.9 x 6 |
4.5 x 4 |
2.9 x 2.8 |
3.5 x 2.5 |
3.5 x 2.5 |
3 x 3 |
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3 x 4.9 |
0.637 x 0.637 |
5 x 5 |
| Package type |
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SOIC |
VQFN-HR |
SOT-23 |
WQFN |
WQFN |
WQFN |
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VSSOP |
DSBGA |
VQFN |
| Pin count |
|
8.0 |
26 |
5 |
16 |
16 |
16 |
|
8 |
4 |
32 |
| Rating |
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Catalog |
Automotive |
Catalog |
Automotive |
Automotive |
Catalog |
Automotive |
Catalog |
Catalog |
Catalog |
| Signaling rate(max)(MBits) |
|
12 |
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| Supply current(max)(A) |
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5000 |
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2 |
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| Supply voltage(nom)(V) |
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3.3,5 |
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| TI functional safety category |
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Functional Safety-Capable |
Functional Safety-Compliant |
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| TI.com inventory |
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18380 |
9550 |
2090 |
194500 |
10875 |
11147 |
0 |
6981 |
179500 |
66184 |
| Approx. price(US$) |
|
1.43 | 1ku |
2.2 | 1ku |
.252 | 1ku |
.17 | 1ku |
.197 | 1ku |
1.71 | 1ku |
.319 | 1ku |
.91 | 1ku |
.113 | 1ku |
1.07 | 1ku |
| Configurability |
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Factory programmable,Software configurable |
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| Iout(max)(A) |
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4 |
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0.2 |
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| Iq(typ)(mA) |
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0.0067 |
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0.0002 |
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| LDO |
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0 |
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| Pitch(mm) |
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0.5 |
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0.65 |
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| Processor name |
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Generic |
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| Processor supplier |
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Generic |
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| Product type |
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Processor and FPGA |
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| Regulated outputs(#) |
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4 |
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1 |
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| Shutdown current (ISD)(typ)(A) |
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1.4 |
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| Step-down DC/DC controller |
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0 |
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| Step-down DC/DC converter |
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4 |
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| Step-up DC/DC controller |
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0 |
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| Step-up DC/DC converter |
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0 |
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| Switching frequency(max)(kHz) |
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2200 |
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| Switching frequency(typ)(kHz) |
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2000 |
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| Vin(max)(V) |
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5.5 |
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6 |
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| Vin(min)(V) |
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2.8 |
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1.5 |
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| Vout(max)(V) |
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3.36 |
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5 |
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| Vout(min)(V) |
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0.6 |
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0.8 |
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| Architecture |
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CMOS |
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String |
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| CMRR(typ)(dB) |
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110 |
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| GBW(typ)(MHz) |
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16 |
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| Iout(typ)(A) |
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0.05 |
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| Iq per channel(typ)(mA) |
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2 |
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| Number of channels |
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1 |
8 |
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| Rail-to-rail |
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Out |
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| Slew rate(typ)(V/s) |
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9 |
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| THD + N at 1 kHz(typ)(%) |
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0.0001 |
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| TI package name |
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DBV |
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| Total supply voltage (+5 V = 5, 5 V = 10)(max)(V) |
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36 |
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| Total supply voltage (+5 V = 5, 5 V = 10)(min)(V) |
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4.5 |
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| Vn at 1 kHz(typ)(nVHz) |
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4.5 |
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| Vos (offset voltage at 25C)(max)(mV) |
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2 |
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| Data rate(max)(MBits) |
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120 |
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1 |
| Data rate(max)(Mbps) |
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120 |
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1 |
| Function |
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Addressable latch |
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| IOH(max)(mA) |
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-7.8 |
-7.8 |
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| IOL(max)(mA) |
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7.8 |
7.8 |
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| Input type |
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Schmitt-Trigger |
Schmitt-Trigger |
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| Output type |
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Push-Pull |
Push-Pull |
Buffered Current,Buffered Voltage |
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| Supply voltage(max)(V) |
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6 |
6 |
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5.5 |
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| Supply voltage(min)(V) |
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2 |
2 |
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2.3 |
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| Technology family |
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HCS |
HCS |
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| Bits(#) |
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8 |
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| Clock frequency(MHz) |
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68 |
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| Configuration |
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Serial-in, Parallel-out |
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| INL(max)(n±LSb) |
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1 |
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| INL(max)(nLSB) |
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1 |
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| Interface type |
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I2C,SPI |
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SPI |
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| Number of DAC channels |
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4 |
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| Output range(max)(mA/V) |
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5.5 |
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| Output range(min)(mA/V) |
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0 |
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| Power consumption(typ)(mW) |
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1 |
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| Reference type |
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Ext,Int |
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| Resolution(Bits) |
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10 |
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| Sample/update rate(Msps) |
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0.25 |
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| Settling time(s) |
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20 |
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| Package Group |
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SOIC|8,SON|8,SOT-23-THIN|8 |
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| Protocols |
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CAN,CAN FD |
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| Common mode voltage(V) |
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-12 to 12 |
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| Number of channels(#) |
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1 |
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| Package size |
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mm2 |
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| Supply voltage(V) |
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4.5 to 5.5 |
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| Signaling rate(Max)(Mbps) |
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8 |
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| Low power mode |
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Standby |
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| Bus fault voltage(V) |
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-58 to 58 |
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| Magnetic sensing range(mT) |
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150,300,75 |
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| Sample rate(ksps) |
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20 |
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| Sensitivity error(%) |
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2.5 |
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| Type |
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3-Axis linear |
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| Accuracy(%) |
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1.5 |
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| Dropout voltage (Vdo)(typ)(mV) |
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205 |
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| Fixed output options(V) |
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1.75 |
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| Load capacitance(min)(F) |
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1 |
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| Maximum package height(mm) |
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0.4 |
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| Noise(Vrms) |
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130 |
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| Output options |
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Fixed Output |
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| PSRR at 100 KHz(dB) |
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35 |
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| Thermal resistance JA(C/W) |
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201.1 |
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| Drivers per package |
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3 |
| ESD HBM(kV) |
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15 |
| Logic voltage(min)(V) |
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3.3 |
| Main supply voltage(nom)(V) |
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3.3, 5 |
| Receivers per package |
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5 |
| Vout(typ)(V) |
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5.4 |
